Thermal Management
A Top-Side Cooled Package to Best Dissipate Heat
In recent years, semiconductor manufacturers have developed power component packages which use a different thermal management approach - instead of placing the thermal pad on the bottom of a device pointing towards the PCB, the exposed metal pad is placed on the top side of the device.
Audience:
Automotive Component Manufacturers, Electric Vehicle Manufacturers, Thermal Management Researchers, Thermal Systems Engineers
Automotive Component Manufacturers, Electric Vehicle Manufacturers, Thermal Management Researchers, Thermal Systems Engineers
Link:
Full Document
Electric Vehicle Design
Design of a Smart Actuation for a Fully Electrified Suspension System
Audience:
Automotive Component Manufacturers, Automotive Engineers, Electric Vehicle Designers, Electric Vehicle Developers, EV Manufacturers, Power Electronics Researchers
Automotive Component Manufacturers, Automotive Engineers, Electric Vehicle Designers, Electric Vehicle Developers, EV Manufacturers, Power Electronics Researchers
Keyword:
E-Volve Cluster, High Voltage Components, HIPE, Integrated Motor Drive, Sensors and Actuators, Wide Bandgap Devices
E-Volve Cluster, High Voltage Components, HIPE, Integrated Motor Drive, Sensors and Actuators, Wide Bandgap Devices
Link:
ResearchGate